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Semiconductor
Application Overview
Danble provides a full range of temp & humid reliability testing solutions, ideal for high-sensitivity scenarios such as chip packaging and wafer storage. These professional solutions help semiconductor products pass automotive/industrial-grade certifications, boost yield and shorten R&D cycles.
  • Chips
    Core performance verification is required during chip R&D and packaging stages.
    High-low temp performance test Thermal shock test Low-pressure (high-altitude) test
  • Material Testing
    Performance verification of semiconductor materials (e.g., silicon wafers, photoresists, packaging substrates, metal leads).
    Temp-humid aging test Salt spray corrosion test UV aging test
  • Packaging & Storage
    As a key link connecting chips to the outside world, it verifies the reliability of packaged chips in complex environments.
    Combined temperature cycling & damp-heat test High-temp storage test Vibration & shock test Radiation resistance test
  • Equipment Components
    Core components of production equipment (e.g., lithography machines, ion implanters, wafer cleaners) require stable operation conditions; environmental test chambers can verify their reliability.
    High-low temp vibration test Cleanroom environment simulation
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