Please enter your search keywords!

CN

Semiconductor Memory Test Chamber
Product Introduction
Danbo Instruments Semiconductor Memory Test Chamber is specifically designed for high- and low-temperature reliability testing of chip PCBs. Featuring independently controlled dual chambers, it ensures zero condensation throughout the chambers and delivers ultra-high precision. All components are CE-certified, meeting the requirements for batch testing of memory chips.
Get a Quote
Product Features
Specification
Specifications Parameters
Left Chamber Dimensions 600×280×1040 mm (W×D×H)
Right Chamber Dimensions 600×280×1040 mm (W×D×H)
External Dimensions 2800×1310×1950 mm
Inner Chamber Thickness 1.2 mm
Inner Chamber Material Brushed Stainless Steel
Outer Cabinet Material Cold-Rolled Steel with Baked Paint Finish
Temperature Range -10℃ to +100℃
Heating Rate 3℃/min (Under Load, 3.2 kW Heat Dissipation per Chamber)
Cooling Rate 1℃/min (Under Load, 3.2 kW Heat Dissipation)
Static Load Capacity 60 kg of Memory Chips per Chamber
Temperature Uniformity ≤±3.0℃
Temperature Fluctuation ≤±0.5℃
Temperature Deviation ≤±2℃
Cooling Method Air Cooling
Applications
Get a Quote
*Contact Person
*Phone
*Product Requirements Categories
Describe your requirements
*Verification code

Copyright ©  Danbo Instrument (Kunshan) Co.,Ltd all reserved.

Site Map | Legal Notice | Privacy Policy |