| Specifications | Parameters |
|---|---|
| Left Chamber Dimensions | 600×280×1040 mm (W×D×H) |
| Right Chamber Dimensions | 600×280×1040 mm (W×D×H) |
| External Dimensions | 2800×1310×1950 mm |
| Inner Chamber Thickness | 1.2 mm |
| Inner Chamber Material | Brushed Stainless Steel |
| Outer Cabinet Material | Cold-Rolled Steel with Baked Paint Finish |
| Temperature Range | -10℃ to +100℃ |
| Heating Rate | 3℃/min (Under Load, 3.2 kW Heat Dissipation per Chamber) |
| Cooling Rate | 1℃/min (Under Load, 3.2 kW Heat Dissipation) |
| Static Load Capacity | 60 kg of Memory Chips per Chamber |
| Temperature Uniformity | ≤±3.0℃ |
| Temperature Fluctuation | ≤±0.5℃ |
| Temperature Deviation | ≤±2℃ |
| Cooling Method | Air Cooling |
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